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yl23455永利研发的HI802和HI802P是针对异质结电池封装的一体化胶膜。一体化胶膜对圆焊丝的完美塑形效果和一步法的链接/层压工艺，不仅可承受各种老化需求而且促进较高的焊带粘结力。
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